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Package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP.

• -1.77842 7.79176 19.9496 facet normal -0.346103 0.295604.
• 11.5x15mm^2, drill diamater 1.3mm, pad diameter.
• File Images/PXL_20210831_002553634.jpg main synth_tools/README.md 0 lines Latest.

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