3
1
Back

TSOP-I, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size.

New Pull Request