Labels Milestones
Back22-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-7 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-4, Vertical, RM 2.54mm, staggered type-2 TO-220-9 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-11, Vertical, RM 2.54mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4 Vertical RM 2.54mm TO-220-4 Vertical RM 2.54mm TO-251-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-9, Horizontal, RM.
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