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Back*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1.
- -0.29018 0.956545 vertex 1.57536 7.91987 5.88782.
- Vertical_space/7; row_3 = row_2 + vertical_space/7.