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Number: 26-60-5150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST EH series connector, LY20-16P-DLT1, 8 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2191, 21 Circuits (https://www.molex.com/pdm_docs/sd/2005280210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 160 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0630, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0204, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times 2 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, see.

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