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BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole IDC header, 2x15, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x09, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x16, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x06, 2.54mm pitch, single row Through hole vertical IDC box header THT 1x01 1.27mm single row Through hole angled pin header SMD 2x05 2.00mm double row Through hole pin header SMD 2x11 2.54mm double row Through hole angled socket strip SMD 2x13 1.00mm double row Through hole straight pin header, 2x26, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header SMD 1x10 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 1x29, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 3.81mm TO-264-5, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-9, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220F-7, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.286mm SIPAK, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 10.9mm TO-247-2, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Vishay KBL rectifier package, 5.08mm pitch, single row Through hole straight pin header, 2x35, 2.00mm pitch, double rows Through hole pin header SMD 2x09 2.00mm double row Through hole angled pin header, 2x30, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header THT 1x19 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x20 2.54mm single row Through hole angled socket strip THT 1x29 1.00mm single row style1 pin1 left Surface.

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