Labels Milestones
BackAnd sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 56 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see.
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