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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 472.

4.0 Type-C receptable, through-hole mount, SMD, right-angle.
Normal -6.225669e-001 -7.825666e-001 0.000000e+000 vertex.
Wuerth_MAPI-3020, 3.0mmx3.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-2020.
0]; cv_in_2a = [left_col, row_3.
Vertex -8.646397e+000 4.992000e+000 0.000000e+000.

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