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[TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220-4, Vertical, RM 2.54mm, staggered type-1 TO-220F-9, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.27mm staggered type-2 TO-220-7, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 5.45mm TO-3P-3, Vertical, RM 2.54mm TO-251-2, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 2.54mm staggered type-2 TO-220-15, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 10.95mm SOT-93 TO-218-2, Vertical, RM 2.54mm, staggered type-1 TO-220-7 Vertical RM 1.7mm staggered type-2 TO-220-9, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 5.45mm TO-3PB-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4 Horizontal RM 2.54mm TO-251-2, Horizontal, RM.

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