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Bump 3x4 (area) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225.

• 64.51mm diameter vertical toroid mount, 16AWG/1.27mm.
• 6.745033e-001 6.247002e-001 facet normal -0.875977 -0.471404 0.102188 facet.

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