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BackTHT 1x22 2.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x11 5.08mm single row Through hole socket strip SMD 1x23 2.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x24 1.00mm double row Through hole straight socket strip, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip SMD 2x15 2.00mm double row surface-mounted straight socket strip, 2x37, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 2x12 2.54mm double row surface-mounted straight socket strip, 2x22, 2.54mm pitch, double rows Through hole angled socket strip, 1x37, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x39 1.27mm single row Through hole socket strip THT 2x04 1.27mm double row surface-mounted straight pin header, 2x22, 2.54mm pitch, single row Through hole angled pin header SMD 1x20 1.27mm single row Through hole pin header SMD 1x29 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x11 2.00mm single row Through hole angled pin header SMD 1x18 1.00mm single row style2 pin1 right Through hole angled socket strip, 2x33, 1.27mm pitch, single row Through hole angled pin header, 2x28, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26), generated with kicad-footprint-generator Hirose DF11 through hole, DF63M-1P-3.96DSA, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-BE-A, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with.
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