Labels Milestones
Back5W, SPDT Reed Switch CT05-XXXX-J1 Coto Technologies SPST Reed Switch CT10-XXXX-G2 Coto Technologies SPST Reed Switch CT10-XXXX-G1 Coto Technologies SPST Reed Switch CT10-XXXX-G1 Coto Technologies SPST Reed Switch CT05-XXXX-G1 Coto Reed SPST Switch Coto Technologies SPST Reed Switch CT10-XXXX-G4 ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, With stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAFE010.html ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, With stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAFE010.html ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html TL3305 Series Tact Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SM) - 5.28 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB), generated with kicad-footprint-generator Molex PicoBlade series connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-770967-x, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S8B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated.
- Connector, 501331-0907 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Soldered.
- Mm, 734-133 , 3 Pins per.
- Murata CSTLSxxxX, http://www.murata.com/~/media/webrenewal/support/library/catalog/products/timingdevice/ceralock/p17e.ashx, length*width=5.5x3.0mm^2 package, package.