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Black D-size flange, mirrored self tapping screw holes (A-screw), horizontal PCB mount, https://www.neutrik.com/en/product/ncj6fi-h-0 Combo I series, 3 pole male XLR receptacle, grounding: mating connector shell to pin1 and front panel, steel retention lug, horizontal PCB mount, retention spring, https://www.neutrik.com/en/product/ncj6fi-h Combo I series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, steel retention lug, vertical PCB mount, https://www.neutrik.com/en/product/nc5mbv-sw B Series, 5 pole female XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, horizontal PCB mount, asymmetric push, https://www.neutrik.com/en/product/nc3fbv1-da B Series, 5 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, asymmetric push, https://www.neutrik.com/en/product/ncj6fa-h-da Combo A series, 3 pole XLR female receptacle with 6.35mm (1/4in) stereo jack, switched, gold plated contacts, half threaded nose, https://www.neutrik.com/en/product/nrj6hf-au Slim Jacks, 6.35mm (1/4in) switching stereo jack, unswitched, fully threaded nose, https://www.neutrik.com/en/product/nrj6hh Slim Jacks, 6.35mm (1/4in) mono jack (T/S), https://www.neutrik.com/en/product/nj2fd-v 6.35mm (1/4 in) Vertical Jack, 3 x 3 mm, 0.5 mm pitch, ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Piano.

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