Labels Milestones
BackBelow exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf Footprint for Mini-Circuits case TTT167 (https://ww2.minicircuits.com/case_style/TTT167.pdf Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-236, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-236, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf Footprint for the pots unneeded for expected pot effect direction). 2 5mm LEDs Latest commits for file Synth_Manuals/Module Summaries.ods