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TO-262-3 Vertical RM 2.54mm TO-220F-5, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 2.54mm TO-220-3, Vertical, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 2.54mm TO-220-4, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body.

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