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*.kicad_pro *.rules *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Autorouter files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: merged pull request synth_mages/MK_VCO#5

everything done as a kind of odd LFO. Current draw PCB layout: front, back How to use for rounding teh top edge. ≥30 means "round, using current quality setting". Top_rounding_faces .

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