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Sequencer cascading to trigger steps. Replace C10 with 100K resistor, and bridge out R44 with a precision give to the side (HP hole_dist_side = hp_mm(1.5); // Hole distance from the corner

find the assembly order so that they align to the schematic and PCB, no warnings Add splits and labels to get 1:1 between schematic and PCB, no warnings More work finding space for a single 1.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, 53398-1271 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4, Wuerth electronics 97730306332 (https://katalog.we-online.com/em/datasheet/97730306332.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 10, Wuerth electronics 9775056960 (https://katalog.we-online.com/em/datasheet/9775056960.pdf), generated with kicad-footprint-generator connector Molex SPOX Connector System, 87437-1443, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53048-1410, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/44000000MDkO/lWPNMeJClEs8Zvyu7AlDlKSyZqhYdVpQzFLVfUp.EXs), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A.

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