synth_tools

Back

1-826576-8, 18 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S11B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-13P-1.25DSA, 13 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-A, 13 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator JST SH series connector, S9B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST EH series connector, SM15B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770621-x, 6 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0060, 6 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP Switch SPST Slide 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing.

New Pull Request

Labels Milestones