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BackShaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Sensortech MiCS MEMS sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP.
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