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BackPad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm HSOP 11.0x15.9mm Pitch 1.27mm SSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTB_2,5/4-GF-5,08; number of pins: 04; pin pitch: 5.00mm; Angled; threaded flange || order number: 1806258 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/9-GF-3.81; number of pins: 16; pin pitch: 5.00mm; Vertical || order number: 1844304 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/13-GF-3.81; number of.
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