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B11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV-A, 47 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 53780-0970 (), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0014 example for new mpn: 39-28-922x, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-A, 12 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7811045, 10 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-LC, 18 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV-BE, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET SA.

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