Labels Milestones
BackMils 14-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package.
- P1; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp.
- (https://product.tdk.com/info/en/catalog/datasheets/inductor_automotive_power_slf12565-h_en.pdf Inductor, TDK, SLF6025.
- MC_1,5/11-GF-5.08; number of pins: 13.