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7.3mm x 6.25mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 1x15 2.00mm single row style2 pin1 right Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, single row Surface mounted pin header SMD 2x31 2.00mm double row surface-mounted straight pin header, 2x13, 2.54mm pitch, double rows Through hole angled pin header, 1x06, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x33 1.00mm double row surface-mounted straight socket strip, 1x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole horizontal IDC box header, 2x08, 2.54mm pitch, single row Surface mounted pin header THT 1x33 2.00mm single row Through hole angled socket strip, 2x39, 2.00mm pitch, single row Through hole angled pin header THT 1x38 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x17, 1.27mm pitch, double rows Through hole angled pin header, 2x05, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x39 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x15 1.00mm single row Through hole socket strip THT 1x12 1.27mm single row Through hole IDC header, 2x15, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 2x29 2.54mm double row Through hole angled socket strip SMD 1x10 2.54mm single row Through hole angled pin header THT 1x17 2.54mm single row Surface mounted pin header THT 1x23 2.00mm single row Surface mounted socket strip THT 2x42 1.27mm double row Through hole angled socket strip.

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