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Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL ZIF 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils.

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