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Mils 22-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row.

• MC_1,5/15-GF-3.81; number of pins: 03; pin pitch: 5.08mm.
• 1.006749e+02 1.197185e+01 facet normal 0.0980238 0.995184 0.
• 21.8214 facet normal 0.63066 0.768477 0.108216 facet normal.
• Vertex -6.313201e+000 3.108942e+000 9.983999e+000 vertex.

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