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Body [TSSOP] with exposed pad TSSOP, 14 Pin (JEDEC MO-153 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator.

• Jack, https://www.cliffuk.co.uk/products/dcconnectors/FC681465S.pdf Surface-mount DC Barrel Jack.
• 0.0426235 -0.554793 0.830896 vertex -0.499373 -7.3432.
• Type-C receptacle for USB 2.0 receptacle.
• 4.4 2.47561 19.9 facet.
• B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex SlimStack.

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