synth_tools

Back

6C USB4135-GF-A 16-pin USB-C receptacle, USB2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf usb usb-c 2.0 pd USB TYPE C, USB 2.0, SMT, https://www.jae.com/en/connectors/series/detail/product/id=91780 USB C Type-C Receptacle SMD GT-USB-7051A GT-USB-7051B USB 2.0 Type C (https://www.bulgin.com/products/pub/media/bulgin/data/Battery_holders.pdf Comfortable Electronic CR2450 battery holder, Keystone P/N 2462, https://www.keyelco.com/product-pdf.cfm?p=1027 1xAAA Battery Holder, BX0036, Battery Type 3xAA battery CR1225 coin cell vertical Panasonic CR-1220/VCN battery, https://industrial.panasonic.com/cdbs/www-data/pdf2/AAA4000/AAA4000D140.PDF battery CR-1220 coin cell vertical battery CR-2025 coin cell battery holder, Keystone P/N 2468, http://www.keyelco.com/product-pdf.cfm?p=1033 AAA battery cell holder CR2032 retainer clip, SMT ( http://www.farnell.com/datasheets/1505853.pdf BC-2001 CR2032 2032 Battery Holder BH-331P Battery Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.25mm 206mil JPin SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball.

New Pull Request

Labels Milestones