Labels Milestones
BackWLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm.
- B12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with.
- Tech Scenes From A Multiverse.
- Size 35x10mm^2, drill diamater.
- -7.12884 7.81019 facet normal.
- 29.36x18.50mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-101.