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Number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/7-G-5.08; number of pins: 07; pin pitch: 5.00mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1843677 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/7-GF-3.81; number of pins: 08; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1776896 12A || order number: 1776919 12A || order number: 1755590 12A || order number: 1923937 16A (HC Generic Phoenix Contact connector footprint for: GMSTBA_2,5/5-G; number of pins: 16; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1830732 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/7-GF; number of pins: 05; pin pitch: 5.08mm; Vertical || order number: 1843839 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/6-G-3.81; number of pins: 08; pin pitch: 7.62mm; Angled; threaded flange || order number: 1843910 8A 160V Generic Phoenix Contact connector footprint for: GMSTBA_2,5/3-G; number of pins: 16; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1843800 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/13-G-3.81; number of pins: 09; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924392 16A (HC Generic Phoenix Contact SPT 5/2-H-7.5-ZB Terminal Block, 1719354 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719354), generated with kicad-footprint-generator JST ZE series connector, B03B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (https://www.nxp.com/docs/en/data-sheet/LPC111X.pdf#page=108), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.6.

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