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BackCASE 506AH-01 (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99066A sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to EWG1308/2013 10/100/1000 Base-T RJ45 single port with LEDs and 75W POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c ethernet POE 10/100/1000 Base-T RJ45 single port with LEDs and 75W POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c dual ethernet cat5 Shielded, 2 LED, 2 Ports, http://www.amphenolinfocom.eu/NavData/Drawings/RJHSE-538X-02-REVC.pdf RJ45 8p8c quad ethernet cat5 Shielded, 2 LEDs, tab down, http://www.hanrun.com/public/upload/down/2020/09-11/cc11be56d66bb63d5f1eeb85492439c0.pdf Through hole pin header THT 1x06 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x16 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x25 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x39, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 2x02, 1.00mm pitch, single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length, 1x08, 5.08mm pitch, single row Through hole socket strip SMD 2x18 1.27mm double row Through hole angled pin header SMD 2x40 2.00mm double row Through hole straight socket strip, 2x40, 1.27mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header SMD 1x05 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x39 1.00mm double row Through hole angled socket strip THT 1x34 1.27mm single row (from Kicad 4.0.7.
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