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/ IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 1x03 5.08mm single row style2 pin1 right Through hole angled pin header, 1x16, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x33, 1.27mm pitch, double rows Through hole angled socket strip, 2x01, 2.00mm pitch, double rows Through hole IDC header, 2x08, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x11, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x05 5.08mm single row Through hole angled socket strip, 2x17, 2.00mm pitch, double rows Through hole socket strip THT 1x28 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x10 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x09, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x12 1.27mm single row Surface mounted pin header SMD 2x09 2.00mm double row Through hole angled pin header THT 1x06 2.00mm single row style1 pin1.

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