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Package IQD Crystal Clock Oscillator TXCO Fordahl DFA S2-KS/LS/US, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, hand-soldering, 7.5x5.0mm^2 package SI570, SI571, Programmable oscillator, Standard SI570 SI571 Programmable oscillator Standard SMD Crystal Oscillator Seiko Epson MC-405 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, 9.6x4.1mm^2 package SMD Crystal EuroQuartz MJ series http://cdn-reichelt.de/documents/datenblatt/B400/MJ.pdf, hand-soldering, 5.0x3.2mm^2 package 3.2x2.5mm, 1-220MHz High Performance Differential Oscillator SiTime SiT9121 https://www.sitime.com/datasheet/SiT9121 Silicon_Labs LGA, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lis2dh.pdf), generated with kicad-footprint-generator TE, 826576-6, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: https://www.vishay.com/docs/40182/tmch.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SS)-5.30 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin, exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm.

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