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WLCSP-132, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC box header 2x07 2.54mm double row surface-mounted straight pin header, 1x29, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight pin header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 1x11, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x25 1.00mm single row Surface mounted socket strip SMD 1x36 1.27mm single row Through hole straight pin header, 1x31, 1.27mm pitch, double rows Through hole angled socket strip THT 1x09 1.27mm single row Through hole angled pin header SMD 1x15 2.00mm single row Surface mounted socket strip SMD 2x39 2.00mm double row Through hole straight socket strip, 2x09, 1.27mm pitch, double rows Through hole angled pin header THT 1x20 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x34 2.54mm double row surface-mounted straight pin header, 2x06, 1.00mm pitch, double rows Through hole angled socket strip, 2x38, 2.00mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length THT 1x16 2.54mm single row style2 pin1 right Through hole socket strip SMD 1x27 1.00mm single row Surface mounted pin header THT 1x30 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x15 5.08mm single.

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