Labels Milestones
Back3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 SBG485.
- Electronics 9774080360 (https://katalog.we-online.de/em/datasheet/9774080360.pdf), generated with kicad-footprint-generator Soldered.
- Resistor, Box series, Radial, pin pitch=2.50mm, , diameter=7.0mm.
- 173.745 115.005 (end 177.88.