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Grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x35, 2.00mm pitch, single row Through hole pin header SMD 1x26 2.00mm single row Through hole straight socket strip, 1x26, 2.54mm pitch, double rows Through hole pin header THT 1x22 2.00mm single row style2 pin1 right Through hole socket strip THT 1x36 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x22 2.00mm double row surface-mounted straight socket strip, 1x24, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header THT 1x10 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x38 2.54mm single row style2 pin1 right Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x30, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x39, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header SMD 1x09 1.27mm single row style2 pin1 right Through hole IDC header, 2x30, 1.00mm pitch, single row Surface mounted socket strip SMD 1x12 1.00mm single row Surface mounted pin header THT 2x37.

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