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BackCross at 90° to minimize capacitance between traces vias connect through the power subsystem tracks the ratsnest and compactifies the power 2 From 398c2b234cc710f69bb9085257ff5dbf3509a410 Mon Sep 17 00:00:00 2001 Subject: [PATCH] schematics tweaks README.md Normal file View File true L1 2 keahS oidaR 32ded0979b Fix rail clearance issues, make all power main synth_tools/Schematics/SynthMages.pretty/Switch.lib 1741 lines main MK_VCO/Schematics/resistor_keyboard.diy 497 lines ebf8c2dd87 Move LED resistors next to transistors to save on panel wires Update to 7.0, slider footprint Update to 7.0, slider footprint adds ideas for a single 1.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective.
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- Pitch=10.16mm, , length*diameter=7*3.3mm^2, Fastron, MICC, http://www.fastrongroup.com/image-show/70/MICC.pdf?type=Complete-DataSheet&productType=series.