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Chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator connector wire 0.25sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 5 times 0.25 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV-BE, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/8-V-5.0-EX 1732551 Connector Phoenix Contact, SPT 5/8-V-7.5-ZB Terminal Block, 1732438 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732438), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector Hirose DF63 through hole, DF11-12DP-2DSA, 6 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx08, With thermal vias in pads, 2 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for a single 0.15 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-03A example for new mpn: 39-29-4169, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-4010, 40 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 505405-1370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wire, basic insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 52 Pin (https://www.nxp.com/docs/en/package-information/98ARL10526D.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System.

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