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PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight socket strip, 1x02, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 2x03, 2.54mm pitch, double rows Through hole pin header THT 2x12 2.54mm double row Through hole straight socket strip, 1x35, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x36 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x14 2.54mm double row surface-mounted straight pin header, 2x40, 2.54mm pitch.

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