Labels Milestones
BackSOIC 2.54 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (http://www.ti.com/lit/ds/symlink/ads1115.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf LQFN, 48 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0144.PDF), generated with kicad-footprint-generator Molex CLIK-Mate series.
- Circuits (https://www.molex.com/pdm_docs/sd/2005280140_sd.pdf), generated with kicad-footprint-generator.
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- Normal -0.0624786 -0.0761302 0.995138 vertex -4.32991.