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28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600.

• 1.108416e-15 -1.577818e-15 -1.000000e+00 facet normal -0.0992318 0.0992318 -0.990104.
• Microphone LGA Dust Water TDK InvenSense Knowles MEMS.
• Keyswitch 1.00u Matias/ALPS keyswitch.
• LFO Color Spray - Noise.

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