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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 461, 4.63x4.15mm.

• Schematics/MK_Schematic.png | Bin 0 -> 38860 bytes Panels/Font.
• 0.463056 0.881604 facet normal.
• Between // h = engraved_indicator_depth.

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