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(https://katalog.we-online.com/em/datasheet/97730356330.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package LFCSP (5mm x 5mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see.

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