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2.0, SMT, https://www.jae.com/en/connectors/series/detail/product/id=91780 USB C Type-C Receptacle SMD USB 2.0 Type C Receptacle, https://gct.co/Files/Drawings/USB4085.pdf USB Type-C receptacle for USB 2.0 Type B TWP-4002D-H3, https://www.technik.com.hk/images/pdf_product/WP4002D-H3-A_2.0.pdf USB Micro B USB SMD Micro USB B receptacle, Horizontal, through-hole, http://www.on-shore.com/wp-content/uploads/2015/09/usb-b1hsxx.pdf USB-B receptacle horizontal through-hole USB type A right angle Würth USB-A two stacked horizontal receptacle, through-hole (https://www.cuidevices.com/product/resource/uj2-adh-th.pdf USB-A CUI stacked horizontal through-hole USB B receptable with flange, bottom-mount, SMD, right-angle (http://en.connfly.com/static/upload/file/pdf/DS1104-01.pdf USB 3.0 type A right angle Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator connector wire 1.5sqmm strain-relief Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-169 , 9 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

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