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Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA.

• Header 2x12 2.54mm double row surface-mounted straight pin.
• Diameter 3mm, see , script-generated.

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