3
1
Back

- 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator JST PH series connector, DF52-7S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 28 pins, surface mount SMD Kemet EC2 signal relay DPDT non single coil latching surface mount PLCC, 28 pins, surface mount PLCC, 28 pins, through hole straight socket strip, 2x21, 2.00mm pitch, 6.35mm socket length, single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x31 2.00mm double row surface-mounted straight pin header, 1x03, 2.54mm pitch, double rows Through hole straight pin header, 2x29, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x22 2.00mm single row Through hole IDC header, 2x07, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x10 2.54mm single row Surface mounted socket strip.

New Pull Request