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Diameter 1.8mm, hole diameter 1.1mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole socket strip THT 2x34 1.27mm double row Through hole angled pin header SMD 2x19 1.00mm double row Through hole socket strip THT 1x36 2.54mm single row Through hole straight pin header, 2x22, 2.54mm pitch, single row Through hole pin header SMD 1x18 1.00mm single row Surface mounted socket strip THT 1x26 2.00mm single row Through hole angled socket strip, 2x10, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x12 2.00mm double row Through hole straight pin header, 2x37, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch.

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