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3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip, 1x24, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 1x34 2.54mm single row Through hole pin header THT 2x12 1.27mm double row surface-mounted straight pin header, 1x16, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x30 1.27mm single row Through hole angled pin header THT 2x09 2.00mm double row Through hole angled pin header, 1x40, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x38, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, single row style2 pin1 right Through hole socket strip SMD 1x40 1.00mm single row Surface mounted socket strip THT 1x03 5.08mm single row Through hole angled pin header SMD 2x07 2.00mm double row Through hole angled pin header, 2x13, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip SMD 1x25 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x04 2.00mm single row Through hole angled pin header THT 1x36 1.00mm single row Through hole socket strip THT 2x39 1.27mm double row Through hole pin header THT 1x04 5.08mm single row Through hole angled socket strip, 1x02, 2.54mm pitch, double rows Through hole angled pin header.

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