synth_tools

Back

Electronics 9771130360 (https://katalog.we-online.com/em/datasheet/9771130360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-BE-A, 48 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276), generated with kicad-footprint-generator Molex Pico-Lock series connector, S04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xx-DV-TE, 25 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MC MOSFET.

New Pull Request

Labels Milestones