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Package (8MA2) - 2x3x0.6 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0300.

• Normal 0.195087 0.980786 -5.76575e-07.
• 5.51437 21.6407 facet normal 6.116634e-14.
• Elektronik, Wuerth_MAPI-2508, 2.5mmx2.0mm Inductor, Wuerth Elektronik, WE-DD, SMD.

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