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BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x34 1.00mm single row Surface mounted socket strip THT 2x40 1.27mm double row surface-mounted straight socket strip, 2x28, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted pin header THT 1x29 2.54mm single row Surface mounted socket strip SMD 1x05 2.00mm single row Through hole pin header SMD 1x28 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x37 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x01 1.00mm double row surface-mounted straight socket strip, 2x05, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x32, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole.

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